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Headphone
Injection Moulding Machine Set up
Machine Type: HTF120X1 Plastic-Injection Moulding Machine
Clamping Force: 120T
Plasticizing Capacity: 200g

  • PRODUCT INFO
  • TECH INFO
  • IMPORTANT NOTE
Moulding Feature 
Cavity: 1
Gate: Sub Gate
Ejection Method: Ejector + Lifter
Mold Temperature: 70-90°C

Products Feature
Material: PP+PC/ABS C6200+TPU
Color: Red & Black
Product Weight: 0.5~20.0g
Runner Weight:3.0~8.0g

Mold Feature 
Mould Type: Injection Moulding Dual-Shot Moulding
Mould Base: LKM CI 3040 
Mould Core Material: S136 Hardened   
Runner System: Cool Runner

    subject : Headphone